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XBP06V1E4MR-G_15 Datasheet, PDF (3/4 Pages) Torex Semiconductor – Transient Voltage Suppressor | |||
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XBP06V1E4MR-G
ËPACKAGING INFORMATION
Ëç SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole: 4 x 0.8 Diameter
è©Ev価aluåºatiæ¿on ã¬Boã¤ardã¢(Uã¦niãt: mï¼åm) ä½ï¼mmï¼
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 150Ë)
Ambient Temperatureï¼âï¼
25
105
Power Dissipation Pdï¼mWï¼
750
270
Thermal Resistance (â/W)
166.67
800
700
600
500
400
300
200
100
0
25
Pd-Taç¹Pdæ§vsã°. Tã©a ã
50
75
100
125
150
Ambå¨ienå²t Te温m度perTaatuï¼râe: Tï¼a (Ë)
3/4
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