XC6419 Datasheet, PDF (28/29 Pages) Torex Semiconductor – Dual LDO Regulator (ch1=300mA, ch2=100mA) with ON/OFF Switch

XC6419 Series
˙PACKAGING INFORMATION (Continued)
˔ç USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125ˆ)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
1000
100
85
400
1200
1000
800
600
400
200
0
25
Pd vs. Ta
45
65
85
105
125
Ambient Temperature Ta（℃）
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