XC8107-15 Datasheet, PDF (25/27 Pages) Torex Semiconductor – High Function Power Switch

■PACKAGING INFORMATION (Continued)
● USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole 4 x 0.8 Diameter
XC8107
Series
2. Power Dissipation vs. Ambient Temperature (105℃)
Evaluation Board (Unit: mm)
Board Mount (Tjmax=125℃)
Ambient Temperature (℃)
25
105
Power Dissipation Pd (mW)
1000
200
Thermal Resistance (℃/W)
100.00
1200
1000
800
600
400
200
0
25
Pd-^PT^da特^vs.性^Taグラフ
45
65
85
105
125
Ambie周nt 囲Tem温pe度raTtuar（e:℃Ta）(℃)
25/27