XC6221A252MR-G Datasheet, PDF (24/28 Pages) Torex Semiconductor – Low ESR Caps Compatible High Speed LDO Voltage Regulator with ON/OFF Switch

XC6221 Series
■PACKAGING INFORMATION (Continued)
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the front and 50% of the back.
The copper area is divided into four block, one block is 12.5%
of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front and
one in the back.
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
40.0
2.5
28.9
Evaluation Board (Unit：mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
600
166.67
85
240
700
600
500
400
300
200
100
0
25
Pd Vs. Ta
45
65
85
105
125
Ambient Temperature: Ta（℃）
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