XC6222D251MR-G Datasheet, PDF (22/26 Pages) Torex Semiconductor – Reverse Current Protection, 700mA High Speed LDO Regulator

XC6222 Series
■PACKAGING INFORMATION (Continued)
● USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
て
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
Evaluation Board (Unit: mm)
Thermal Resistance (℃/W)
25
1000
100.00
85
400
1200
1000
800
600
400
200
0
25
Pd-Ta_P特_d 性_vs.グ_Taラフ
45
65
85
105
125
Ambien周t T辺em温pe度ratTurae（T℃a (）℃)
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