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XC6222 Datasheet, PDF (22/26 Pages) Torex Semiconductor – Reverse Current Protection, 700mA High Speed LDO Regulator | |||
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XC6222 Series
â PACKAGING INFORMATION (Continued)
â USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
ã¦
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125â)
Ambient Temperatureï¼âï¼
Power Dissipation Pdï¼mWï¼
Evaluation Board (Unit: mm)
Thermal Resistance (â/W)
25
1000
100.00
85
400
1200
1000
800
600
400
200
0
25
Pd-TaPç¹d æ§vs.ã°Taã©ã
45
65
85
105
125
Ambienå¨t T辺em温pe度ratTuraeï¼Tâa (ï¼â)
22/26
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