XC6802-12 Datasheet, PDF (17/21 Pages) Torex Semiconductor – 800mA Single Cell Li-ion Battery Linear Charger IC

˙PACKAGING INFORMATION (Continued)
˔ç SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
て
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
XC6802
Series
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125ˆ)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
1300
520
Thermal Resistance (℃/W)
76.92
1400
1200
1000
800
600
400
200
0
25
Pd-Ta_P特_d性_vsグ_{. Ta}ラフ
45
65
85
105
125
Ambien_周t T_辺em_温pe_度rat_Tur_ae_（T_℃a _）(ˆ)
17/21