XCL221 Datasheet, PDF (12/20 Pages) Torex Semiconductor – 0.5A Inductor Built-in Step-Down “micro DC/DC” Converters

XCL221/XCL222 Series
■NOTE ON USE (Continued)
18. Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,
please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the
VIN pin, PGND pin.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at
the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-
channel MOS driver transistors. Please consider the countermeasures against heat if necessary.
<Reference pattern layout>
<Top View>
<Back Side Top View>
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