XC6214_2 Datasheet, PDF (10/26 Pages) Torex Semiconductor – 500mA Output Current, High Speed LDO Regulators, Thermal Shutdown Function, Ceramic Capacitor Compatible

XC6214 Series
˙POWER DISSIPATION (TO-252) (Continued)
˔ç TO-252 Power Dissipation
Power dissipation data for the TO-252 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125ˆ)
Ambient Temperature（℃） Power Dissipation Pd（mW）
25
1800
85
720
Thermal Resistance (℃/W)
55.56
2000
1800
1600
1400
1200
1000
800
600
400
200
0
25
Pd-Ta特_Pd性_vグ_s. ラ_Taフ
45
65
85
105
125
Ambien周t T辺em温pe度raTtuar（e℃Ta） (ˆ)
10/26