XC25BS6 Datasheet, PDF (1/4 Pages) Torex Semiconductor – Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit

XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
September 17, 2003 V1
„ CMOS
„ Low Operating Supply Voltage
„ Output Frequency
„ Oscillation Frequency
„ Built-In Divider Circuit
„ Output
„ Ultra Small Package
„ Chip Form
Low Power Consumption
2.3V (MIN.)
32.768kHz
2MHz ~ 36MHz (fundamental)
Selectable from divisions of
1024, 512, 256, 128
3-State
SOT-26
„ APPLICATIONS
z Crystal Oscillation Modules
z Clocks for Micro-computers, DSPs, etc.
z Communication Equipment
z Various System Clocks
z Clock Time-Base
„ GENERAL DESCRIPTION
The XC25BS6 is a low operating voltage, low current consumption
series of CMOS ICs with built-in crystal oscillator and divider circuits
designed for clock generators. Oscillation capacitors Cg and Cd are
externally set up.
Output is selectable from any one of the following values for f0:f0/1024,
f0/512, f0/256, and f0/128.
With oscillation feedback resistors built-in, it is possible to configure a
stable fundamental oscillator using about 10pF of external oscillation
capacitor and an external crystal.
The series has a stand-by function. The oscillation completely stops in
the stand-by state and output will be one of high-impedance.
„ FEATURES
Oscillation Frequency
Divider Ratio
Output
Operating Supply
Voltage Range
Supply Current
Chip Form
Package
2MHz ~ 36MHz (fundamental)
- Oscillation feedback resistor built-in
- External oscillation capacitor
f0/1024, f0/ 512, f0/256, f0/128
3-State
2.3 ~ 4.0V
0.5µA (MAX.) when stand-by mode
Chip size 1.3 x 0.8mm
SOT-26 mini mold
„ PIN CONFIGURATION
/XT 1
VSS 2
Q0 3
6 XT
5 VDD
4 CE
„ PIN ASSIGNMENT
PIN
PIN NUMBER _NAME
FUNCTIONS
1
/ XT
Crystal Oscillator
Connection (Output)
2
VSS
Ground
3
Q0
Clock Output
4
CE
Stand-by Control *
5
VDD
Power Supply
6
XT
Crystal Oscillator
Connection (Input)
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
„ PAD LAYOUT FOR CHIP FORM
(1300,800)
VSS
/XT
(NC) VSS Q0
VDD
VDD
XT
CE
(0,0)
Chip Size
: 1300 x 800µm
Chip Thickness _{: 280±20µm}
Chip Back _{: VDD level}
Pad Aperture _{: 88 x 88 µm}
Note)
There are two VSS
pads and two VDD
pads. Please connect
both VSS pads to
GND, and connect
both VDD pads to a
power supply.
„ PAD LOCATIONS
PIN
PIN NUMBER
NAME
1
/ XT
2
VSS
3
(NC)
4
VSS
5
Q0
6
VDD
7
CE
8
XT
9
VDD
FUNCTIONS
Crystal Oscillator
Connection (Output)
Ground
No Connection
Ground
Clock Output
Power Supply
Stand-by Control *
Crystal Oscillator
Connection (Input)
Power Supply
(Unit:µm)
PAD DIMENSIONS
X
Y
128.0
328.0
741.0
952.0
1172.0
1172.0
1172.0
610.0
672.0
672.0
672.0
672.0
430.0
189.0
128.0
128.0
187.0
399.0
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
„ BLOCK DIAGRAM
VDD
/XT
Counter
XT
Q0
CE
VSS
„ CE, Q0 PIN FUNCTION
CE
'H'
'L' or Open
Q0
Clock Output
High Impedance
Semiconductor Ltd.
Data Sheet
1