MAX16838B Datasheet, PDF (2/21 Pages) Maxim Integrated Products – Integrated, 2-Channel, High-Brightness LED Driver with High-Voltage Boost and SEPIC Controller

MAX16838B
Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
Absolute Maximum Ratings
IN, OUT_, DRAIN to SGND...................................-0.3V to +45V
EN to SGND................................................-0.3V to (V_IN + 0.3V)
PGND to SGND.....................................................-0.3V to +0.3V
LEDGND to SGND................................................-0.3V to +0.3V
DRV to PGND.......... -0.3V to the lower of (V_IN + 0.3V) and +6V
GATE to PGND........................................................-0.3V to +6V
NDRV to PGND....................................... -0.3V to (V_DRV + 0.3V)
V_CC, FLT, DIM, CS, OV, CFB, to SGND..................-0.3V to +6V
RT, COMP, ISET to SGND........................ -0.3V to (V_CC + 0.3V)
DRAIN and CS Continuous Current....................................±2.5A
OUT_ Continuous Current................................................175mA
V_DRV Short-Circuit Duration.......................................Continuous
Continuous Power Dissipation (T_A = +70ºC)
20-Pin TQFN (derate 25.6mW/ºC above +70ºC).......2051mW
20-Pin TSSOP (derate 26.5mW/ºC above +70ºC).....2122mW
Operating Temperature Range...........................-40ºC to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range..............................-65ºC to +150°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Juction-to-Ambient Thermal Resistance (θ_JA)...........+39°C/W
Junction-to-Case Thermal Resistance (θ_JC)................+6°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ_JA)......+37.7°C/W
Junction-to-Case Thermal Resistance (θ_JC)................+2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_IN = V_EN = 12V, R_RT = 12.2kΩ, R_ISET = 15kΩ, C_VCC = 1µF, V_CC = V_DRV = V_CFB, DRAIN, COMP, OUT_, FLT = unconnected, V_OV
= V_CS = V_LEDGND = V_DIM = V_PGND = V_SGND = 0V, V_GATE = V_NDRV, T_A = T_J = -40ºC to +125°C, unless otherwise noted. Typical
values are at T_A = 25°C.) (Note 2)
PARAMETER
Input Voltage Range
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
DRV REGULATOR
Output Voltage
Dropout Voltage
Short-Circuit Current Limit
V_CC Undervoltage Lockout
Threshold
SYMBOL
V_IN
V_IN
I_Q
I_SH
UVLO_IN
CONDITIONS
Internal LDO on
V_IN = V_CC
V_DIM = 5V
V_EN = SGND (Note 3)
V_IN rising, V_DIM = 5V
V_DRV
5.75V < V_IN < 10V, 0.1mA < I_LOAD < 30mA
6.5V < V_IN < 40V, 0.1mA < I_LOAD < 3mA
V_DO
(V_IN - V_DRV)
V_IN =
4.75V, I_OUT =
30mA
DRV shorted to GND
UVLO_VCC V_CC rising
MIN
4.75
4.55
4
4.75
3.4
TYP
3.1
15.5
4.3
177
5
0.11
97
4.0
MAX
40
5.5
5
40
4.55
UNITS
V
V
mA
µA
V
mV
5.25
V
0.5
V
mA
4.4
V
V_CC (UVLO) Hysteresis
123
mV
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