TPS65982_16 Datasheet, PDF (92/117 Pages) Texas Instruments – USB Type-C and USB PD Controller, Power Switch, and High-Speed Multiplexer

TPS65982
SLVSD02C – MARCH 2015 – REVISED AUGUST 2016
PP_EXT
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PP_HV
PP_5V0
PP_HV Gate Control
and Current Limit
Fast
current
limit
PP_5V0 Gate Control
and Current Limit
HV Gate Control and Sense
Fast
current
limit
VBUS
AGND
Copyright © 2016, Texas Instruments Incorporated
Figure 86. Schottky on VBUS for Current Surge Protection
11 Layout
11.1 Layout Guidelines
Proper routing and placement will maintain signal integrity for high-speed signals and improve the thermal
dissipation from the TPS65982 power path. The combination of power and high-speed data signals are easily
routed if the following guidelines are followed. It is a best practice to consult with a printed circuit board (PCB)
manufacturer to verify manufacturing capabilities.
11.1.1 TPS65982 Recommended Footprints
11.1.1.1 Standard TPS65982 Footprint (Circular Pads)
Figure 87 shows the TPS65982 footprint using a 0.25mm pad diameter. This footprint is applicable to boards that
will be using an HDI PCB process that uses smaller vias to fan-out into the inner layers of the PCB. This footprint
requires via fill and tenting and is recommended for size-constrained applications. The circular footprint allows for
easy fan-out into other layers of the PCB and better thermal dissipation into the GND planes. Figure 88 shows
the recommended via sizing for use under the balls. The size is 5mil hole and 10mil diameter. This via size will
allow for approximately 1.5A current rating at 3 mΩ of DC resistance with 1.6nH of inductance. It is
recommended to verify these numbers with board manufacturing processes used in fabrication of the PCB. This
footprint is available for download on the TPS65982 product folder on the TPS65982 product folder.
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