TUSB8044 Datasheet, PDF (9/61 Pages) Texas Instruments – Four-Port USB 3.1 Gen1 Hub with USB Billboard

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TUSB8044
SLLSEW5 – APRIL 2017
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply Voltage Range
Voltage Range
V_DD Steady-state supply voltage
V_DD33 Steady-state supply voltage
USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1],
USB_SSRXN_DP[4:1] and USB_VBUS terminals
XI terminals
All other terminals
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
1.4
V
–0.3
3.8
V
-0.3
1.4
V
-0.3
2.45
V
-0.3
3.8
V
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD ⁽¹⁾
1.1V supply voltage
MIN
NOM
0.99
1.1
VDD33
3.3V supply voltage
3
3.3
USB_VBUS Voltage at USB_VBUS PAD
0
T_A
Operating free-air temperature
T_J
Operating junction temperature
TUSB8044
0
–40
(1) A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.
MAX
1.26
3.6
1.155
70
105
UNIT
V
V
V
°C
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TUSB8044
RGC
UNIT
64 PINS
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
26
°C/W
11.5
°C/W
5.3
°C/W
0.2
°C/W
5.2
°C/W
1.0
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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