CC1101-Q1 Datasheet, PDF (89/94 Pages) Texas Instruments – Low-Power Sub-1-GHz Fractional-N UHF Device Family for Automotive

PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2012
PACKAGING INFORMATION
Orderable Device
CC1101IRHBRG4Q1
CC1101QRHBRG4Q1
CC1101TRHBRG4Q1
CC1131IRHBRG4Q1
CC1131QRHBRG4Q1
CC1131TRHBRG4Q1
CC1151IRHBRG4Q1
CC1151QRHBRG4Q1
CC1151TRHBRG4Q1
Status ^{(1) Package Type Package}
Drawing
ACTIVE
QFN
RHB
Pins
32
Package Qty
3000
ACTIVE
ACTIVE
QFN
QFN
RHB
32
RHB
32
3000
3000
ACTIVE
QFN
RHB
32
3000
ACTIVE
QFN
RHB
32
3000
ACTIVE
ACTIVE
QFN
QFN
RHB
32
RHB
32
3000
3000
ACTIVE
QFN
RHB
32
3000
ACTIVE
QFN
RHB
32
3000
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
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(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 1