LM3S1C26 Datasheet, PDF (800/805 Pages) Texas Instruments – Stellaris® LM3S1C26 Microcontroller

Package Information
C
C.1
C.1.1
Package Information
64-Pin LQFP Package
Package Dimensions
ASAT ^R
Figure C-1. Stellaris LM3S1C26 64-Pin LQFP Package
D
D
1
N
1
A
B
E₁ E
D
12° TYP.
A2
A1
12° TYP.
0.20 RAD. TYP.
0.20 RAD. TYP.
A
e
ANOTHER VARIATION OF PIN 1 VISUAL AID
N
1
6° ±4°
A
.25
O
0.17 MAX.
L
STANDOFF
A₁
b
ddd M C A-B S D S
SEATING
PLANE
C
LEAD COPLANARITY
ccc C
800
Texas Instruments-Production Data
FOOT PRINT
PACKAGE THICKNESS
DIMS.
TOL.
LEADS
A
MAX.
A₁
A₂
±.05
D
±.20
D₁
±.10
E
±.20
E₁
±.10
L
+.15/-.10
e
BASIC
b
±.05
O
ddd
MAX.
ccc
MAX.
JEDEC REFERENCE DRAWING
VARIATION DESIGNATOR
44L
.80
.35
.20
MS-02
AC
NOTE
1. All dimensions in mm.
2. Dimension shown are nominal with tolerance
3. Foot length 'L' is measured at gage plane 0.2
4. L/F: Eftec 64T Cu or equivalent, 0.127mm (0.
DO NOT SCALE DRAWING
THIS DOCUMENT CONTAINS INFORMATION
DEPT.
DRAWN
CHECK
NAME
S. PEDRON
J.GUICO
SIGN
DATE P.E.
Dec. 2002 P.D.E
Q.A.
January 22, 2012