ISO7340C Datasheet, PDF (8/37 Pages) Texas Instruments – Robust EMC, Low-Power, Quad-Channel Reinforced Digital Isolators

ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC
SLLSEI6F – SEPTEMBER 2014 – REVISED AUGUST 2016
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7.4 Thermal Information
THERMAL METRIC⁽¹⁾
ISO734x
DW (SOIC)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
78.4
°C/W
41
°C/W
43
°C/W
15.6
°C/W
42.5
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Power Ratings
V_CC1 = V_CC2 = 5.5 V, T_J = 150°C, C_L = 15 pF, Input a 12.5-MHz 50% duty cycle square wave
PARAMETER
TEST CONDITIONS
P_D Maximum power dissipation by both sides of ISO7340x
P_D1 Maximum power dissipation by side-1 of ISO7340x
P_D2 Maximum power dissipation by side-2 of ISO7340x
P_D Maximum power dissipation by both sides of ISO7341x
P_D1 Maximum power dissipation by side-1 of ISO7341x
P_D2 Maximum power dissipation by side-2 of ISO7341x
P_D Maximum power dissipation by both sides of ISO7342x
P_D1 Maximum power dissipation by side-1 of ISO7342x
P_D2 Maximum power dissipation by side-2 of ISO7342x
MIN TYP MAX UNIT
92
24 mW
68
102
42 mW
60
111
55.5 mW
55.5
8
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