JM38510-65701B2A Datasheet, PDF (7/21 Pages) Texas Instruments – HEX INVERTERS

PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
SN74HC04PWRE4
SN74HC04PWRG4
SN74HC04PWT
SN74HC04PWTE4
SN74HC04PWTG4
SNJ54HC04FK
SNJ54HC04J
SNJ54HC04W
Status Package Type Package Pins Package Qty
(1)
Drawing
Eco Plan Lead/Ball Finish MSL Peak Temp
(2)
(3)
Op Temp (°C) Top-Side Markings
(4)
ACTIVE
TSSOP
PW 14
2000
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
-40 to 85 HC04
ACTIVE
TSSOP
PW 14
2000
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
-40 to 85 HC04
ACTIVE
TSSOP
PW 14
250
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04
& no Sb/Br)
ACTIVE
TSSOP
PW 14
250
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04
& no Sb/Br)
ACTIVE
TSSOP
PW 14
250
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04
& no Sb/Br)
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
-55 to 125 84098012A
SNJ54HC
04FK
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type -55 to 125 8409801CA
SNJ54HC04J
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type -55 to 125 8409801DA
SNJ54HC04W
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Only one of markings shown within the brackets will appear on the physical device.}
Addendum-Page 3