CD4081BME4 Datasheet, PDF (7/31 Pages) Texas Instruments – CMOS AND Gates

PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
CD4082BM96G4
CD4082BME4
CD4082BMG4
CD4082BMT
CD4082BMTE4
CD4082BMTG4
CD4082BNSR
CD4082BNSRE4
CD4082BNSRG4
CD4082BPW
CD4082BPWE4
CD4082BPWG4
CD4082BPWR
CD4082BPWRE4
CD4082BPWRG4
JM38510/17001BCA
JM38510/17002BCA
JM38510/17003BCA
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
Package
Drawing
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SO
NS
SO
NS
SO
NS
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
CDIP
J
CDIP
J
CDIP
J
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
1
TBD
A42
N / A for Pkg Type
14
1
TBD
A42
N / A for Pkg Type
14
1
TBD
A42
N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3