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BQ29400_16 Datasheet, PDF (7/16 Pages) Texas Instruments – VOLTAGE PROTECTION
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2016
PACKAGING INFORMATION
Orderable Device
BQ29400ADCT3
BQ29400ADCT3E6
BQ29400ADCT3R
BQ29400DCT3
BQ29400DCT3E6
BQ29400PW
BQ29400PWR
BQ29401PW
BQ29405DCT3
BQ29405DCT3R
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
NRND
SM8
DCT 8 3000
Pb-Free
(RoHS)
NRND
SM8
DCT 8 3000
Pb-Free
(RoHS)
OBSOLETE SM8
DCT 8
TBD
NRND
SM8
DCT 8 3000
Pb-Free
(RoHS)
NRND
SM8
DCT 8 3000
Pb-Free
(RoHS)
NRND
TSSOP
PW
8
150 Green (RoHS
& no Sb/Br)
NRND
TSSOP
PW
8 2000 Green (RoHS
& no Sb/Br)
NRND
TSSOP
PW
8
150 Green (RoHS
& no Sb/Br)
NRND
SM8
DCT 8 3000
Pb-Free
(RoHS)
NRND
SM8
DCT 8
TBD
Lead/Ball Finish
(6)
CU SNBI
CU SNBI
Call TI
CU SNBI
CU SNBI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SNBI
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -25 to 85
Level-1-260C-UNLIM -25 to 85
Call TI
Level-1-260C-UNLIM
-25 to 85
Level-1-260C-UNLIM
Level-1-260C-UNLIM -25 to 85
Level-1-260C-UNLIM -25 to 85
Level-1-260C-UNLIM -20 to 85
Level-1-260C-UNLIM -25 to 85
Call TI
-25 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
CIT
W
CIT
W
CIQ
CIQ
29400
29400
29401
CIS
W
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 1