ADC12DL080_15 Datasheet, PDF (7/34 Pages) Texas Instruments – A/D Converter for IF Sampling

ADC12DL080
www.ti.com
SNAS345A – FEBRUARY 2006 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
V_A, V_D, V_DR
|V_A–V_D|
Voltage on Any Input or Output Pin
Input Current at Any Pin⁽⁴⁾
Package Input Current⁽⁴⁾
Package Dissipation at T_A = 25°C
ESD Susceptibility
Human Body Model⁽⁶⁾
Machine Model⁽⁶⁾
4.2V
≤ 100 mV
−0.3V to (V_A or V_D +0.3V)
±25 mA
±50 mA
See ⁽⁵⁾
2500V
250V
Soldering Temperature, Infrared, 10 sec.⁽⁷⁾
Charge Device Model
750V
235°C
Storage Temperature
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.⁽⁷⁾
−65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, V_IN < AGND, or V_IN > V_A), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two.
(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature, (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax - T_A )/θ_JA. In the 64-pin TQFP, θ_JA is 50°C/W, so P_DMAX = 2 Watts at 25°C and 800 mW at the maximum operating
ambient temperature of 85°C. Note that the power consumption of this device under normal operation will typically be about 497 mW
(447 typical power consumption + 50 mW TTL output loading). The values for maximum power dissipation listed above will be reached
only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply
voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
(7) Reflow Reflow temperature profiles are different for lead-free and non-lead-free packages.
Operating Ratings⁽¹⁾⁽²⁾
Operating Temperature
Supply Voltage (V_A, V_D)
Output Driver Supply (V_DR)
CLK, PD, OF/DOEN, OEA/OF, OEB/DRDY
Analog Input Pins
V_CM
|AGND–DGND|
Clock Duty Cycle (DCS On)
Clock Duty Cycle (DCS Off)
−40°C ≤ T_A ≤ +85°C
+3.0V to +3.6V
+2.4V to V_D
−0.05V to (V_D + 0.05V)
0V to 2.6V
1.0V to 2.0V
≤100mV
30% to 70%
40% to 60%
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
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