TMP006BIYZFR Datasheet, PDF (6/21 Pages) Texas Instruments – Infrared Thermopile Sensor in Chip-Scale Package

TMP006
TMP006B
SBOS518C – MAY 2011 – REVISED DECEMBER 2012
OVERVIEW
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The TMP006 and TMP006B are digital temperature sensors that are optimal for thermal management and
thermal protection applications where remote non-contact sensing is desired. The TMP006 and TMP006B are
two-wire and SMBus interface compatible, and are specified over the ambient temperature range of –40°C to
+125°C. The TMP006 and TMP006B measure object temperatures over a temperature range of –40°C to
+125°C. The TMP006 and TMP006B contain registers for holding configuration information, temperature
measurement results, and sensor voltage measurement. Ambient temperature and sensor voltage
measurements are used to calculate the object temperature. Refer to the TMP006 User Guide (SBOU107) for
more details.
The SCL and SDA interface pins require pull-up resistors (10 kΩ, typical) as part of the communication bus, while
DRDY is an open-drain output that must also use a pull-up resistor. DRDY may be shared with other devices if
desired for a wired-OR implementation. A 0.01-μF power-supply bypass capacitor is recommended, as shown in
Figure 4.
V+
B3
SCL
C3
SDA
C2
DRDY
A3
Device
C_F > 0.01 mF
B1
ADR1
C1
ADR0
A2
A1
AGND DGND
Figure 4. Typical Connection Diagram
The TMP006 and TMP006B provide both local temperature and thermopile sensor voltage outputs in a WCSP.
The local temperature sensor in both the TMP006 and TMP006B is integrated on-chip; the thermal path runs
through the WCSP solder balls. The low thermal resistance of the solder balls provides the thermal path to
maintain the chip at the temperature of the local environment.
The top side of the WCSP must face the object that is being measured with an unobstructed view in order to
accurately measure the temperature. Refer to the user guide TMP006 Layout and Assembly Guidelines
(SBOU108) for more details.
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