TLE202X_17 Datasheet, PDF (6/77 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
100
140
1IN + ⁽³⁾
V_{CC +}
(4)
+
(2)
1IN −
−
(7)
+
2OUT
−
2IN + ⁽¹⁰⁾ ₊
(9)
3IN −
−
4OUT
(14)
+
−
(11)
V_{CC − /GND}
(1)
1OUT
(5)
2IN +
(6)
2IN −
(8)
3OUT
(12)
4IN +
(13) _{4IN −}
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T_Jmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
6
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