TLC5940_15 Datasheet, PDF (6/38 Pages) Texas Instruments – 16-Channel LED Driver

TLC5940
SLVS515D – DECEMBER 2004 – REVISED NOVEMBER 2015
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Recommended Operating Conditions (continued)
t_su0
t_su1
t_su2
t_su3
t_su4
t_su5
t_su6
t_h0
t_h1
t_h2
t_h3
t_h4
t_h5
t_prog
Setup time
Hold Time
SIN to SCLK ↑⁽¹⁾ (see Figure 11)
SCLK ↓ to XLAT ↑ (see Figure 11)
VPRG ↑ ↓ to SCLK ↑ (see Figure 11)
VPRG ↑ ↓XLAT ↑ (see Figure 11)
BLANK ↓ to GSCLK ↑ (see Figure 11)
XLAT ↑ to GSCLK ↑ (see Figure 11)
VPRG ↑ to DCPRG ↑ (see Figure 16)
SCLK ↑ to SIN (see Figure 11)
XLAT ↓ to SCLK ↑ (see Figure 11)
SCLK ↑ to VPRG ↑ ↓ (see Figure 11)
XLAT ↓ to VPRG ↑ ↓ (see Figure 11)
GSCLK ↑ to BLANK ↑ (see Figure 11)
DCPRG ↓ to VPRG ↓ (see Figure 11)
Programming time for EEPROM (see Figure 16)
(1) ↑ and ↓ indicates a rising edge, and a falling edge respectively.
MIN NOM
5
10
10
10
10
30
1
3
10
10
10
10
1
20
MAX
UNIT
ns
ns
ns
ns
ns
ns
ms
ns
ns
ns
ns
ns
ms
ms
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC5940
PWP (HTSSOP) RHB (VQFN)
UNIT
28 PINS
32 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
36.7
34.3
°C/W
18.9
36.8
°C/W
15.9
8.5
°C/W
0.6
0.3
°C/W
15.8
8.7
°C/W
2.3
1.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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