OPA227 Datasheet, PDF (6/46 Pages) Burr-Brown (TI) – High Precision, Low Noise OPERATIONAL AMPLIFIERS

OPA227, OPA2227, OPA4227
OPA228, OPA2228, OPA4228
SBOS110B – MAY 1998 – REVISED JUNE 2015
www.ti.com
6.5 Thermal Information: OPA227P/PA and OPA228P/PA
THERMAL METRIC⁽¹⁾
P (PDIP)
OPA227P/PA
OPA228P/PA
D (SOIC)
N (PDIP)
UNIT
8 PINS
8 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
48.9
110.1
65.5
°C/W
37.7
52.2
20
°C/W
26.1
52.3
25.9
°C/W
15.1
10.4
1.9
°C/W
26
51.5
25.3
°C/W
N/A
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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