OPA188-Q1 Datasheet, PDF (6/37 Pages) Texas Instruments – Precision, Low-Noise, Rail-to-Rail Output, 36-V, Zero-Drift, Automotive-Grade Operational Amplifier

OPA188-Q1, OPA2188-Q1
SBOS860 – APRIL 2017
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Current
Temperature
Supply
Signal input pins⁽²⁾
Signal input pins⁽²⁾
Output short-circuit⁽³⁾
OPA188-Q1, T_J
OPA2188-Q1, T_J
Storage, T_stg
Split-supply
Single-supply
Differential
MIN
MAX
±20
40
(V–) – 0.5
(V+) + 0.5
±0.7
±10
Continuous
150
125
–65
150
UNIT
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, V– or V+.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±1500
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) R_L = 10 kΩ connected to V_S / 2 ⁽¹⁾, and V_CM = V_OUT = V_S /
2 ⁽¹⁾
MIN
NOM
MAX UNIT
Split–supply
V_S
Operating voltage range
Single–supply
±2
±18
V
4
36
OPA188-Q1 Temperature Grade 1: Specified temperature range
–40
T_A
OPA2188-Q1 Temperature Grade 2: Specified temperature range
–40
125
°C
105
(1) V_S / 2 = midsupply.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA188-Q1
DGK (VSSOP)
OPA2188-Q1
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
171.7
62.7
93.0
9.0
91.4
N/A
163.2
57.4
83.4
6.6
82.0
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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