OPA1688 Datasheet, PDF (6/41 Pages) Texas Instruments – OPA168x SoundPlus 36-V, Single-Supply, 10-MHz, Rail-to-Rail Output Operational Amplifiers

OPA1688, OPA1689
SBOS724 – SEPTEMBER 2015
www.ti.com
8.4 Thermal Information: OPA1688
THERMAL METRIC⁽¹⁾
OPA1688
D (SOIC)
DRG (WSON)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
116.1
69.8
56.6
22.5
56.1
N/A
63.2
°C/W
63.5
°C/W
36.5
°C/W
1.4
°C/W
36.6
°C/W
6.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
8.5 Thermal Information: OPA1689
THERMAL METRIC⁽¹⁾
OPA1689
D (SOIC)
RVA (VQFN)
UNIT
14 PINS
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
82.7
TBD
°C/W
42.3
TBD
°C/W
37.3
TBD
°C/W
8.9
TBD
°C/W
37
TBD
°C/W
N/A
TBD
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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