LP8501 Datasheet, PDF (6/51 Pages) National Semiconductor (TI) – Multi-Purpose 9-Output LED Driver

LP8501
SNVS548D – SEPTEMBER 2008 – REVISED AUGUST 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS^(1)(2)(3)
VDD
Voltage on D1 to D9, C1−, C1+, C2−, C2+,
VOUT
Voltage on Logic Pins (Input or Output Pins)
Continuous Power Dissipation⁽⁴⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering)
ESD Rating
Human Body Model: D1 to D9
Human Body Model: All Other Pins
Machine Model: All Pins
−0.3V to +6.0V
−0.3V to + 6.0V
−0.3V to V_DD +0.3V
with 6.0V max
Internally Limited
125°C
−65°C to +150°C
See ⁽⁵⁾
4 kV ⁽⁶⁾
2.5 kV⁽⁶⁾
250V ⁽⁷⁾
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 150°C (typ.) and
disengages at T_J = 130°C (typ.).
(5) For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN1112 : DSBGA Wafer Level
Chip Scale Package.
(6) Human Body Model, applicable standard JESD22-A114C
(7) Machine Model, applicable standard JESD22-A115-A
OPERATING RATINGS⁽¹⁾⁽²⁾
V_DD Input Voltage Range
Voltage on Logic Pins (Input or Output Pins)
Recommended Charge Pump Load Current
2.7V to 5.5V
0 to V_DD
0 mA to 100 mA
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range⁽³⁾
−30°C to +125°C
−30°C to +85°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ_JA)⁽¹⁾,
YFQ0025 Package⁽²⁾
Thermal Package
87°C/W
(1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 150°C (typ.) and
disengages at T_J = 130°C (typ.).
(2) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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