LMX2541 Datasheet, PDF (6/70 Pages) National Semiconductor (TI) – Ultra-Low Noise PLLatinum Frequency Synthesizer with Integrated VCO

LMX2541
SNOSB31J – JULY 2009 – REVISED DECEMBER 2014
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
Vcc
Power Supply Voltage
V_IN
Input Voltage to pins other than Vcc Pins
(3)
MIN
MAX
UNIT
–0.3
3.6
V
–0.3
(Vcc + 0.3)
V
T_L
Lead Temperature (solder 4 sec.)
T_stg
Storage Temperature
260
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Never to exceed 3.6 V.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
Machine model (MM)
VALUE
±2500
±1750
±400
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
Vcc
Power Supply Voltage (All Vcc Pins)
T_A
Ambient Temperature
MIN NOM MAX UNIT
3.15 3.3 3.45 V
–40
85 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMX2541
SQ2060E
9 Thermal
Vias ⁽²⁾
LMX2541
SQ2060E
13 Thermal
Vias ⁽³⁾
LMX2541
SQ2060E
16 Thermal
Vias ⁽⁴⁾
UNIT
R_θJA
ψ_JT
Junction-to-ambient thermal resistance
Junction-to-top characterization parameter
31.7
30.3
29.8
°C/W
7.3
7.3
7.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Recommended for Most Reliable Solderability.
(3) Compromise Between Solderability, Heat Dissipation, and Fractional Spurs.
(4) Recommended for Optimal Heat Dissipation and Fractional Spurs.
6
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