BQ24171 Datasheet, PDF (6/35 Pages) Texas Instruments – JEITA Compliant Stand-Alone Switch-Mode Li-Ion and Li-Polymer Battery Charger with Integrated MOSFETs and Power Path Selector

bq24171
SLUSAF2A – FEBRUARY 2011 – REVISED MAY 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
VALUE
UNIT
AVCC, ACP, ACN, ACDRV, CMSRC, STAT
–0.3 to 30
PVCC
–0.3 to 20
BATDRV, SRP, SRN
–0.3 to 20
SW
Voltage range (with respect to AGND)
FB
–2 to 20
V
–0.3 to 16
OVPSET, REGN, TS, TTC
–0.3 to 7
VREF, ISET, ACSET
–0.3 to 3.6
PGND
–0.3 to 0.3
Maximum difference voltage
SRP–SRN, ACP-ACN
–0.5 to 0.5
V
Junction temperature range, T_J
Storage temperature range, T_stg
–40 to 155
°C
–55 to 155
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
bq24171
RGY
UNITS
θ_JA
Junction-to-ambient thermal resistance⁽²⁾
ψ_JT
Junction-to-top characterization parameter⁽³⁾
ψ_JB
Junction-to-board characterization parameter⁽⁴⁾
24 PINS
35.7
0.4
31.2
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
Input voltage
Output voltage
Output current (R_SR 10mΩ)
Maximum difference voltage
V_IN
V_OUT
I_OUT
ACP - ACN
SRP–SRN
Operation free-air temperature range, T_A
MIN
4.5
0.6
–200
–200
–40
MAX
17
13.5
4
200
200
85
UNIT
V
V
A
mV
mV
°C
6
Submit Documentation Feedback
Product Folder Link(s): bq24171
Copyright © 2011, Texas Instruments Incorporated