TUSB546A-DCI Datasheet, PDF (5/47 Pages) Texas Instruments – USB Type-C DP ALT Mode Linear Redriver Crosspoint Switch

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TUSB546A-DCI
SLLSF14 – JUNE 2017
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply Voltage Range⁽²⁾, V_CC
Voltage Range at any input or output pin
Maximum junction temperature, T_J
Storage temperature, T_stg
Differential voltage between positive and
negative inputs
Voltage at differential inputs
CMOS Inputs
MIN
MAX
UNIT
–0.3
4
V
±2.5
V
–0.5
V_CC + 0.5
V
–0.5
V_CC + 0.5
V
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminals.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±5000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_(12C)
V_(PSN)
T_A
Main power supply
Supply Ramp Requirement
Supply that external resistors are pulled up to on SDA and SCL
Supply Noise on V_CC pins
Operating free-air temperature
TUSB546A-DCI
TUSB546I-DCI
MIN
NOM
MAX UNIT
3
3.3
3.6
V
100
ms
1.7
3.6
V
100
mV
0
70
°C
–40
85
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TUSB546A-DCI
RNQ (WQFN)
UNIT
40 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
37.6
°C/W
20.7
°C/W
9.5
°C/W
0.2
°C/W
9.4
°C/W
2.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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