TPS709_17 Datasheet, PDF (5/34 Pages) Texas Instruments – 150-mA, 30-V, 1-uA IQ Voltage Regulators with Enable

www.ti.com
6 Specifications
TPS709
SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015
6.1 Absolute Maximum Ratings
specified at T_J = –40°C to 125°C (unless otherwise noted); all voltages are with respect to GND⁽¹⁾
MIN
MAX
Voltage
Maximum output current
Output short-circuit duration
V_IN
V_EN
V_OUT
I_OUT
–0.3
32
–0.3
7
–0.3
7
Internally limited
Indefinite
Continuous total power dissipation
Operating junction temperature, T_J
Storage temperature, T_stg
P_DISS
See Thermal Information
–55
150
–55
150
UNIT
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Electrostatic discharge _{Charged device model (CDM), per JEDEC specification JESD22-C101(2)}
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
V_IN
Input voltage
2.7
V_OUT
Output voltage
1.2
V_EN
Enable voltage
0
T_J
Operating junction temperature
–40
NOM
MAX
30
6.5
6.5
125
UNIT
V
V
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS709
DBV
DRV
UNIT
5 PINS
6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
212.1
78.5
39.5
2.86
38.7
N/A
73.1
°C/W
97.0
°C/W
42.6
°C/W
2.9
°C/W
42.9
°C/W
12.8
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: TPS709
Submit Documentation Feedback
5