TPS65263-Q1 Datasheet, PDF (5/47 Pages) Texas Instruments – Output Current Triple Synchronous Step-Down Converter

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6 Specifications
TPS65263-Q1
SLVSCS9C – DECEMBER 2014 – REVISED NOVEMBER 2015
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) ⁽¹⁾
PVIN1, PVIN2, PVIN3,VIN
LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns)
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
EN1, EN2, EN3, V7V, VOUT2, SCL, SDA, PGOOD
FB1, FB2, FB3, COMP1 , COMP2, COMP3, ROSC, SS1, SS2, SS3
AGND, PGND1, PGND2, PGND3
T_J
Operating junction temperature
T_stg
Storage temperature
MIN
MAX
UNIT
–0.3
20
V
–1.0
20
V
–0.3
7
V
–0.3
7
V
–0.3
3.6
V
–0.3
0.3
V
–40
150
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all -2000 2000 pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PVIN1, PVIN2, PVIN3,VIN
LX1, LX2, LX3 (Maximum withstand voltage transient <20 ns)
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3
T_J
Operating junction temperature
MIN
MAX UNIT
4
18 V
–0.8
18 V
–0.1
6.8 V
–0.1
6.3 V
–0.1
3V
–40
125 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS65263-Q1
RHB (VQFN)
UNIT
32 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
33.3
°C/W
25.7
°C/W
7.4
°C/W
0.3
°C/W
7.3
°C/W
2.1
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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