TPS61300_16 Datasheet, PDF (5/70 Pages) Texas Instruments – TPS6130xx 1.5-A and 4.1-A Multiple LED Camera Flash Driver With I2C Compatible Interface

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7 Specifications
TPS61300, TPS61301
TPS61305, TPS61305A, TPS61306
SLVS957E – JUNE 2009 – REVISED APRIL 2016
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage range⁽²⁾
AVIN, VOUT, SW, LED1, LED2, LED3, SCL, SDA, FLASH_SYNC, ENDCL,
NRESET, ENVM, GPIO/PG, HC_SEL, Tx-MASK, TS, BAL
Current on GPIO/PG
Power dissipation
Operating ambient temperature⁽³⁾, T_A
Maxium operating junction temperature, T_J(MAX)
Storage temperature, T_stg
MIN
MAX
–0.3
7
±25
Internally limited
–40
85
150
–65
150
UNIT
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [T_A(MAX)] is dependent on the maximum operating junction temperature [T_J(MAX)], the
maximum power dissipation of the device in the application [P_D(MAX)], and the junction-to-ambient thermal resistance of the part and
package in the application (θ_JA), as given by the following equation: T_A(MAX) = T_J(MAX) – (θ_JA × P_D(MAX))
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
T_J
Operating junction temperature
MIN
MAX UNIT
–40
125 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS6130xx
YFF (DSBGA)
UNIT
20 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
70.9
°C/W
0.4
°C/W
11.4
°C/W
1.9
°C/W
11.2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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