TPS3820_16 Datasheet, PDF (5/29 Pages) Texas Instruments – Voltage Monitor With Watchdog Timer

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7 Specifications
TPS3820, TPS3823, TPS3823A, TPS3824, TPS3825, TPS3828
SLVS165K – APRIL 1998 – REVISED NOVEMBER 2015
7.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)^{(1) (2)}
Voltage
Current
Temperature
V_DD
RESET, RESET, MR, WDI
Maximum low output, I_OL
Maximum high output, I_OH
Output range (V_O < 0 or V_O > V_DD), I_OK
Continuous total power dissipation
Operating free-air, T_A
Storage, T_stg
MIN
MAX
–0.3
6
–0.3
–5
(V_DD + 0.3)
5
–5
5
–10
10
See Thermal Information
–40
85
–65
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted).
V_DD
V_IH
V_IL
Δt/ΔV
T_A
Supply voltage
High-level input voltage at MR and WDI
Low-level input voltage
Input transition rise and fall rate at MR or WDI
Operating free-air temperature range
MIN
1.1
0.7 × V_DD
–40
NOM
MAX
5.5
0.3 × V_DD
100
85
UNIT
V
V
V
ns/V
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS382x
DBV (SOT-23)
UNIT
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
209.1
72.8
36.7
2.1
35.8
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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Product Folder Links: TPS3820 TPS3823 TPS3824 TPS3825 TPS3828