TMP421-Q1 Datasheet, PDF (5/38 Pages) Texas Instruments – Remote and Local Temperature Sensor

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TMP421-Q1, TMP422-Q1, TMP423-Q1
SBOS821 – NOVEMBER 2016
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Power supply, V_S
Input voltage
Pins 1, 2, 3, and 4 only
Pins 6 and 7 only
Input current
Operational temperature
Junction temperature, T_J max
Storage temperature, T_stg
MIN
MAX
UNIT
7
V
–0.5
V_S + 0.5
V
–0.5
7
10
mA
–55
127
°C
150
°C
–60
130
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±3000
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Temperature
Power-supply voltage
MIN
MAX
UNIT
–40
125
°C
2.7
5.5
V
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TMP42x-Q1
DCN (SOT-23)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
147
°C/W
115
°C/W
33
°C/W
38
°C/W
33
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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