TLC2274M-MIL Datasheet, PDF (5/33 Pages) Texas Instruments – Advanced LinCMOS Rail-to-Rail Operational Amplifier

TLC2274M-MIL
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6 Specifications
SLOS985 – JUNE 2017
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V_DD+⁽²⁾
V_DD– ⁽²⁾
Differential input voltage, V_ID(3)
Input voltage, V_I (any input)⁽²⁾
Input current, I_I (any input)
Output current, I_O
Total current into V_DD+
Total current out of V_DD–
Duration of short-circuit current at (or below) 25°C⁽⁴⁾
Operating ambient temperature range, T_A
Storage temperature, T_stg
MIN
MAX
8
–8
±16
V_DD− − 0.3
V_DD+
±5
±50
±50
±50
Unlimited
–55
125
–65
150
UNIT
V
V
V
V
mA
mA
mA
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between V_DD+ and V_DD–.
(3) Differential voltages are at IN+ with respect to IN–. Excessive current will flow if input is brought below V_DD– – 0.3 V.
(4) The output may be shorted to either supply. Temperature or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC
Q100-002 ⁽¹⁾
Charged-device model (CDM), per
AEC Q100-011
Devices in D packages
Devices in D packages
VALUE
±2000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
V_DD±
V_I
V_IC
T_A
Supply voltage
Input voltage
Common-mode input voltage
Operating ambient temperature
MIN
±2.2
V_DD−
V_DD−
–55
MAX
±8
V_DD+ − 1.5
V_DD+ − 1.5
125
UNIT
V
V
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance ⁽²⁾⁽³⁾
Junction-to-case (top) thermal resistance ⁽²⁾⁽³⁾
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
D (SOIC)
14-PIN
115.6
61.8
55.9
14.3
55.4
—
J (CDIP)
14-PIN
—
16.2
—
—
—
—
TLC2274M-MIL
FK (LCCC)
20-PIN
—
18
—
—
—
—
N (PDIP)
14-PIN
W (CFP)
14-PIN
—
121.3
—
—
—
8.68
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) Maximum power dissipation is a function of T_J(max), R_θJA, and T_A. The maximum allowable power dissipation at any allowable ambient
temperature is P_D = (T_J(max) − T_A) / R_θJA. Operating at the absolute maximum T_J of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic).
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