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SM74503 Datasheet, PDF (5/16 Pages) Texas Instruments – 800mA Low-Dropout Linear Regulator
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the Texas Instruments Sales Office/
Distributors for availability and specifications.
Maximum Input Voltage (VIN to GND)
Power Dissipation (Note 2)
Junction Temperature (TJ)
(Note 2)
Storage Temperature Range
20V
Internally Limited
150°C
-65°C to 150°C
Lead Temperature
SOT-223 (MP) Package
ESD Tolerance (Note 3)
260°C, 4 sec
2000V
Operating Ratings (Note 1)
Input Voltage (VIN to GND)
15V
Junction Temperature Range (TJ)(Note 2)
SM74503
−40°C to 125°C
SM74503 Electrical Characteristics
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction
temperature range for operation, −40°C to 125°C.
Symbol
Parameter
Conditions
Min
(Note 5)
Typ
(Note 4)
Max
(Note 5)
Units
VOUT Output Voltage
ΔVOUT Line Regulation
(Note 6)
ΔVOUT Load Regulation
(Note 6)
VIN-V OUT Dropout Voltage
(Note 7)
ILIMIT
Current Limit
Quiescent Current
Thermal Regulation
Ripple Regulation
Temperature Stability
SM74503-3.3
IOUT = 10mA, VIN = 5V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 4.75V ≤ VIN ≤ 10V
SM74503-5.0
IOUT = 10mA, VIN = 7V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V
SM74503-3.3
IOUT = 0mA, 4.75V ≤ VIN ≤ 15V
SM74503-5.0
IOUT = 0mA, 6.5V ≤ VIN ≤ 15V
SM74503-3.3
VIN = 4.75V, 0 ≤ IOUT ≤ 800mA
SM74503-5.0
VIN = 6.5V, 0 ≤ IOUT ≤ 800mA
IOUT = 100mA
IOUT = 500mA
IOUT = 800mA
VIN-VOUT = 5V, TJ = 25°C
SM74503-3.3
VIN ≤ 15V
SM74503-5.0
VIN ≤ 15V
TA = 25°C, 30ms Pulse
fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE =
1VPP
 
3.267
3.168
 
4.950
4.800
800
60
 
3.300
3.300
 
5.000
5.000
 
1
 
1
 
1
 
1
1.10
1.15
1.20
1200
 
5
 
5
0.01
75
0.5
 
3.333
3.432
 
5.050
5.200
 
10
 
15
 
15
 
20
1.30
1.35
1.40
1500
 
15
 
15
0.1
 
V
V
 
V
V
 
mV
 
mV
 
mV
 
mV
V
V
V
mA
 
mA
 
mA
%/W
dB
%
Long Term Stability
RMS Output Noise
Thermal Resistance
Junction-to-Case
TA = 125°C, 1000Hrs
(% of VOUT), 10Hz ≤ f ≤10kHz
4-Lead SOT-223
3-Lead TO-252
0.3
0.003
15.0
10
%
%
°C/W
°C/W
Thermal Resistance
Junction-to-Ambient
No air flow)
4-Lead SOT-223 (No heat sink)
3-Lead TO-252 (No heat sink)(Note 8)
136
°C/W
92
°C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Note 3: For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
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