OPA314 Datasheet, PDF (5/35 Pages) Texas Instruments – 3-MHz, Low-Power, Low-Noise, RRI/O, 1.8-V CMOS OPERATIONAL AMPLIFIER

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THERMAL INFORMATION: OPA314
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA314
OPA2314
OPA4314
SBOS563D – MAY 2011 – REVISED MARCH 2012
OPA314
DBV (SOT23)
DCK (SC70)
5 PINS
5 PINS
228.5
281.4
99.1
91.6
54.6
59.6
7.7
1.5
53.8
58.8
N/A
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2314
THERMAL METRIC⁽¹⁾
D (SO)
OPA2314
DGK (MSOP)
DRB (DFN)
UNITS
8 PINS
8 PINS
8 PINS
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
138.4
89.5
78.6
29.9
78.1
N/A
191.2
61.9
111.9
5.1
110.2
N/A
53.8
69.2
20.1
°C/W
3.8
20.0
11.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4314
THERMAL METRIC⁽¹⁾
OPA4314
PW (TSSOP)
UNITS
14 PINS
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
121.0
49.4
62.8
5.9
62.2
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): OPA314 OPA2314 OPA4314