OPA1641 Datasheet, PDF (5/31 Pages) Texas Instruments – High-Performance, JFET-Input AUDIO OPERATIONAL AMPLIFIERS

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OPA1641, OPA1642, OPA1644
SBOS484C – DECEMBER 2009 – REVISED DECEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S
Supply voltage
V_IN
Input voltage⁽²⁾
I_IN
Input current⁽²⁾
V_IN(DIFF) Differential input voltage
I_O
Output short-circuit⁽³⁾
T_A
Operating temperature
T_J
Junction temperature
T_stg
Storage temperature
MIN
MAX
40
(V-) – 0.5
(V+) + 0.5
±10
±VS
Continuous
–55
125
–65
150
–65
150
UNIT
V
V
mA
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less. The input voltage and output negative-voltage ratings may be exceeded if the input and output
current ratings are observed.
(3) Short-circuit to VS/2 (ground in symmetrical dual-supply setups), one amplifier per package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±3000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+, V-)
Specified temperature
MIN
4.5 (±2.25)
–40
NOM
MAX
36 (±18)
85
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA1641, OPA1642
D (SOIC)
DGK (MSOP)
OPA1644
D (SOIC)
OPA1644
DGK (MSOP)
UNIT
8 PINS
8 PINS
14 PINS
14 PINS
R_θJA Junction-to-ambient thermal resistance
160
180
97
135
°C/W
R_θJC(top) Junction-to-case (top) thermal resistance
75
55
56
45
°C/W
R_θJB Junction-to-board thermal resistance
60
130
53
66
°C/W
ψ_JT
Junction-to-top characterization parameter
9
n/a
19
n/a
°C/W
ψ_JB
Junction-to-board characterization parameter
50
120
46
60
°C/W
R_θJC(bot) Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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