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LP38502SDX-ADJ Datasheet, PDF (5/23 Pages) Texas Instruments – LP38500/2-ADJ, LP38500A/2A-ADJ 1.5A FlexCap Low Dropout Linear Regulator for 2.7V to 5.5V Inputs
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LP38500-ADJ, LP38502-ADJ
www.ti.com
SNVS539F – NOVEMBER 2007 – REVISED APRIL 2013
Electrical Characteristics
LP38500/2–ADJ (continued)
Unless otherwise specified: VIN = 3.3V, IOUT = 10 mA, CIN = 10 µF, COUT = 10 µF, VEN = VIN, VOUT = 1.8V. Limits in standard
type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C.
Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
IDISABLED Ground Pin Current
VEN < VIL(EN)
—
0.025
0.125
15
µA
IOUT(PK)
Peak Output Current
VOUT ≥ VOUT(NOM) - 5%
3.6
A
ISC
Short Circuit Current
VOUT = 0V
2
3.7
A
Enable Input (LP38502 Only)
VIH(EN)
VIL(EN)
td(off)
Enable Logic High
Enable Logic Low
Turn-off delay
td(on)
Turn-on delay
IIH(EN)
Enable Pin High Current
IIL(EN)
Enable Pin Low Current
AC Parameters
VOUT = ON
1.4
VOUT = OFF
—
Time from VEN < VIL(EN) to VOUT =
OFF
—
ILOAD = 1.5A
Time from VEN >VIH(EN) to VOUT =
ON
—
ILOAD = 1.5A
VEN = VIN
—
VEN = 0V
—
—
—
V
—
0.65
25
—
µs
25
—
1
—
nA
0.1
—
PSRR
Ripple Rejection
VIN = 3.0V, IOUT = 1.5A
f = 120Hz
VIN = 3.0V, IOUT = 1.5A
f = 1 kHz
—
58
—
dB
—
56
—
ρn(l/f)
Output Noise Density
en
Output Noise Voltage
Thermal Characteristics
f = 120Hz, COUT = 10 µF CER
BW = 100Hz – 100kHz
COUT = 10 µF CER
—
1.0
—
µV/√Hz
—
100
—
µV (rms)
TSD
ΔTSD
θJ-A
Thermal Shutdown
Thermal Shutdown Hysteresis
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Ambient
TJ rising
TJ falling from TSD
DDPAK/TO-263, PFM(5)
1 sq. in. copper
WSON (6)
—
170
—
°C
—
10
—
—
37
—
°C/W
—
80
—
θJ-C
Thermal Resistance
Junction to Case
DDPAK/TO-263, PFM
WSON
—
5
—
°C/W
—
16
—
(5) The value of θJA for the DDPAK/TO-263 package and PFM package can range from approximately 30 to 60°C/W depending on the
amount of PCB copper dedicated to heat transfer (See Application Information).
(6) θJA for the WSON package was measured using the LP38502SD-ADJ evaluation board (See Application Information).
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