LP211_14 Datasheet, PDF (5/14 Pages) Texas Instruments – LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES

PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
LP211D
LP211DE4
LP211DG4
LP211DR
LP211DRE4
LP211DRG4
LP211P
LP311D
LP311DE4
LP311DG4
LP311DR
LP311DRE4
LP311DRG4
LP311P
LP311PE4
LP311PWLE
Status Package Type Package Pins Package Qty
(1)
Drawing
Eco Plan Lead/Ball Finish MSL Peak Temp
(2)
(3)
Op Temp (°C) Top-Side Markings
(4)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211
& no Sb/Br)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211
& no Sb/Br)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211
& no Sb/Br)
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
-25 to 85 LP211
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
-25 to 85 LP211
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
-25 to 85 LP211
OBSOLETE PDIP
P
8
TBD
Call TI
Call TI
-25 to 85
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
0 to 70 LP311
& no Sb/Br)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
0 to 70 LP311
& no Sb/Br)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
0 to 70 LP311
& no Sb/Br)
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
0 to 70 LP311
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
0 to 70 LP311
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
0 to 70 LP311
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
0 to 70 LP311P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
0 to 70 LP311P
OBSOLETE TSSOP
PW
8
TBD
Call TI
Call TI
0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
Samples