LMV881 Datasheet, PDF (5/19 Pages) Texas Instruments – 23 MHz Low Power CMOS EMI Hardened Operational Amplifier with 1.8V Logic Shutdown

Symbol
Parameter
Conditions
CMVR Input Common-Mode Voltage Range _{CMRR ≥ 65 dB}
A_VOL
Large Signal Voltage Gain
(Note 11)
V_OUT Output Voltage Swing High,
R_L = 2 kΩ
V_OUT = 0.15V to 2.5V,
V_OUT = 4.85V to 2.5V
R_L = 10 kΩ
V_OUT = 0.1V to 2.5V,
V_OUT = 4.9V to 2.5V
R_L = 2 kΩ to V⁺/2
R_L = 10 kΩ to V⁺/2
Output Voltage Swing Low,
R_L = 2 kΩ to V⁺/2
R_L = 10 kΩ to V⁺/2
I_OUT
Output Short Circuit Current
R_OUT
V_OSD
V_EN
I_S
Shutdown Output Resistance
Shutdown Output Voltage
Turn-on Voltage
(Note 12)
Turn-off Voltage
(Note 12)
Supply Current
Sourcing, V_OUT = V_CM,
V_IN = 100 mV
Sinking, V_OUT = V_CM,
V_IN = −100 mV
V_SDN = 0V
V_SDN = 0V,
200Ω pullup from OUT to V+
V_SD> 0.972 V
SR
GBW
Φ_m
e_n
i_n
C_IN
THD+N
Slew Rate (Note 7)
Gain Bandwidth Product
Phase Margin
Input Referred Voltage Noise Density
Input Referred Current Noise Density
Common-Mode Input Capacitance
Differential-Input Capacitance
Total Harmonic Distortion + Noise
In Shutdown,
V_SD< 0.676 V
A_V = +1, V_OUT = 2V_PP,
10% to 90%
f = 1 kHz
f = 100 kHz
f = 1 kHz
f = 1 kHz, A_V= 1, BW ≥ 500 kHz
Min
(Note 6)
−0.2
–0.1
102
101
Typ
(Note 5)
110
Max
(Note 6)
3.9
3.8
Units
V
dB
102
113
101
13
15
19
3
4
5 mV from
10
14 either rail
18
3
4
5
90
110
86
mA
90
110
86
7
Ohms
169
260
mV
≥1
1.5
V
0.3
≤ 0.7
1.9
200
12
23
61
9
5.5
0.015
5
15
0.02
2.45
2.95
mA
pA
V/μs
MHz
deg
nV/
pA/
pF
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics
Tables.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-
Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/ θ_JA . All numbers apply for packages soldered directly onto a PC board.
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that T_J = T_A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where
T_J > T_A.
Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
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