LMH2100 Datasheet, PDF (5/49 Pages) National Semiconductor (TI) – 50 MHz to 4 GHz 40 dB Logarithmic Power Detector for CDMA and WCDMA

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LMH2100
SNWS020C – NOVEMBER 2007 – REVISED OCTOBER 2015
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH2100
YFQ (DSBGA)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance ⁽²⁾
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
6 PINS
133.7
1.7
22.6
5.7
22.2
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/R_θJA. All numbers apply for packages soldered directly into a PC board.
6.5 2.7-V DC and AC Electrical Characteristics
Unless otherwise specified, all limits are ensured at T_A = 25°C, V_DD = 2.7 V, RF input frequency ƒ = 1855 MHz CW
(Continuous Wave, unmodulated). Maximum and minimum limits apply at the temperature extremes.⁽¹⁾.
PARAMETER
TEST CONDITIONS
MIN ⁽²⁾
TYP ⁽³⁾ MAX ⁽²⁾
UNIT
SUPPLY INTERFACE
I_DD
Supply current
LOGIC ENABLE INTERFACE
Active mode: EN = High, no signal present
at RF_IN
Active mode: EN = High, no signal present
at RF_IN
T_A = –40°C to +85°C
Shutdown: EN = Low, no signal present at
RF_IN.
Shutdown: EN = Low, no signal present at
RF_IN.
T_A = –40°C to +85°C
EN = Low: P_IN = 0 dBm⁽⁴⁾
T_A = –40°C to +85°C
6.3
7.1
7.9 mA
5
9.2
0.5
0.9
1.9 µA
10
V_LOW
EN logic low input level (Shutdown T_A = –40°C to +85°C
Mode)
0.6 V
V_HIGH
EN logic high input level
I_EN
Current into EN pin
RF INPUT INTERFACE
T_A = –40°C to +85°C
T_A = –40°C to +85°C
1.1
V
60 nA
R_IN
Input resistance
46.7
51.5
56.4 Ω
(1) 2.7-V DC and AC Electrical Characteristics values apply only for factory testing conditions at the temperature indicated. Factory testing
conditions result in very limited self-heating of the device such that T_J = T_A. No specification of parametric performance is indicated in
the electrical tables under conditions of internal self-heating where T_J > T_A.
(2) All limits are ensured by test or statistical analysis.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(4) All limits are ensured by design and measurements which are performed on a limited number of samples. Limits represent the mean
±3–sigma values.
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