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LM4040A10_16 Datasheet, PDF (5/53 Pages) Texas Instruments – Precision Micropower Shunt Voltage Reference
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LM4040A10, LM4040A20
SLOS456M – JANUARY 2005 – REVISED JANUARY 2015
7 Specifications
7.1 Absolute Maximum Ratings
over free-air temperature range (unless otherwise noted)(1)
IZ
Continuous cathode current
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
MIN
MAX UNIT
–10
25 mA
150 °C
–65
150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
IZ Cathode current
TA Free-air temperature
(1) See parametric tables
LM4040xxxI
LM4040xxxQ
MIN
MAX UNIT
(1)
15 mA
–40
85
°C
–40
125
7.4 Thermal Information
THERMAL METRIC(1)
LM4040xxx
DBZ
DCK
UNIT
3 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
206
252
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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