LM3492HC Datasheet, PDF (5/17 Pages) Texas Instruments – Two-Channel Individual Dimmable LED Driver with Boost Converter and Fast Current Regulator

Symbol
Parameter
Conditions
V_IOUT250-MIN
V_DIM-HIGH
V_DIM-LOW
Boost Converter
Minimum Work Voltage, 250 mA
DIM Voltage HIGH
DIM Voltage LOW
R_IREF = 5 kΩ, I_OUT = 0.98 x I_OUT250
I_CDHC-SRC
CDHC pin source current
V_CDHC = 1.6V, V_FB = 3V, V_IOUT = 0V, DIM
= High
I_CDHC-SINK
CDHC pin sink current
V_CDHC = 1.6V, V_FB = 3V, V_IOUT = 3V, DIM
= High
I_CDHC-PULLUP
I_CL-MAX
CDHC pin pull-up current
Integrated MOSFET peak current limit
threshold
DIM = Low, V_CDHC = 2.3V, V_FB = 3V
I_CL-HALF
Half integrated MOSFET peak current limit R_ILIM = 11 kΩ
threshold
R_DS(on)
V_FBTH-PWRGD
V_FB-OVP
I_FB
Integrated MOSFET R_DS(on)
Power-Good FB pin threshold
FB pin over-voltage protection threshold
FB pin OVP hysteresis
Feedback pin input current
I_SW = 500 mA
V_FB rising, V_CDHC = 4V
V_FB falling
V_FB = 3V
V_IN = 12V, V_OUT = 65V, R_RT = 300 kΩ
t_on
ON timer pulse width
V_IN = 24V, V_OUT = 32.5V, R_RT = 300 kΩ
V_IN = 12V, V_OUT = 65V, R_RT = 100 kΩ
t_on-min-ILIM
V_IN = 24V, V_OUT = 32.5V, R_RT = 100 kΩ
ON timer minimum pulse width at current
limit
t_off
COMM PIN
OFF timer pulse width
V_IOUT-OV
IOUT pin over-voltage threshold
V_COMM-LOW
COMM pin at LOW
I_LEAK-FAULT
COMM pin Open Leakage
Thermal Protection
COMM goes LOW during V_IOUT rising,
other V_IOUT = 1.2V
5 mA into COMM
V_COMM = 5V
T_OTM
T_OTM-HYS
T_SD
T_SD-HYS
Over-temperature indication
T_J rising
Over-temperature indication hysteresis T_J falling
Thermal shutdown temperature
T_J rising
Thermal shutdown temperature hysteresis T_J falling
Min
1.17
10
3.3
2.64
0.1
5.6
Typ Max Units
0.5 0.82 V
V
0.7 V
60
µA
56
µA
200 500 nA
3.9 4.5 A
2.0
A
0.19 0.43 Ω
2.25
V
2.76 2.88 V
0.215 0.323 V
1 µA
1460
ns
800
ns
550
ns
350
ns
145
ns
145 350 ns
6.7 7.8 V
0.7 V
5 µA
135
°C
15
°C
165
°C
20
°C
Note 1: Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of the device is
intended to be functional. For guaranteed specifications and test conditions, see the electrical characteristics. Thermal shutdown might occur within ambient
operating temperature range as junction temperature rises above TSD level, customer should refer to efficiency data and thermal resistance data to estimate the
junction temperature to ambient temperature delta.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3: The θ_JA is measured on a 4-layer standard JEDEC thermal test board with 12 vias, no air flow and 1W power dissipation. Thermal shutdown will occur
if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any
ambient temperature is PD = (T_J(MAX) – T_A) /θ_JA.
Note 4: V_CC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
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