DRV8833_16 Datasheet, PDF (5/30 Pages) Texas Instruments – Dual H-Bridge Motor Driver

www.ti.com
DRV8833
SLVSAR1E – JANUARY 2011 – REVISED JULY 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
VM
Power supply voltage
Digital input pin voltage
xISEN pin voltage
Peak motor drive output current
T_J
Operating junction temperature
T_stg
Storage temperature
MIN
MAX
–0.3
11.8
–0.5
7
–0.3
0.5
Internally limited
–40
150
–60
150
UNIT
V
V
V
A
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
T_A = 25°C (unless otherwise noted)
MIN
V_M
Motor power supply voltage range⁽¹⁾
2.7
V_DIGIN
I_OUT
Digital input pin voltage range
RTY package continuous RMS or DC output current per bridge⁽²⁾
–0.3
(1) R_DS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
(2) V_M = 5 V, power dissipation and thermal limits must be observed.
NOM
MAX
10.8
5.75
1.5
UNIT
V
V
A
6.4 Thermal Information
DRV8833
THERMAL METRIC⁽¹⁾
PWP
(HTSSOP)
RTY
(WQFN)
PW
(TSSOP)
UNIT
16 PINS
16 PINS
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
40.5
37.2
103.1
°C/W
32.9
34.3
38
°C/W
28.8
15.3
48.1
°C/W
0.6
0.3
3
°C/W
11.5
15.4
47.5
°C/W
4.8
3.5
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: DRV8833
Submit Documentation Feedback
5