AMC7891 Datasheet, PDF (5/41 Pages) Texas Instruments – Analog Monitor and Control Circuit with 10-Bit, Multi-Channel ADC and Four DACs, Temperature Sensor, and 12 GPIOs

AMC7891
www.ti.com
SBAS518A – AUGUST 2011 – REVISED DECEMBER 2011
T_A
–40°C to 105°C
ORDER CODE
AMC7891SRHHT
AMC7891SRHHR
ORDERING INFORMATION⁽¹⁾
PACKAGE
DRAWING/TYPE ^{(2) (3)}
RHH / 36-QFN Quad Flatpack No-Lead
TRANSPORT
MEDIA
Tape and Reel
QUANTITY
250
2000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
(2) Thermal Pad Size: 4.39 mm x 4.39 mm
(3) MSL Peak Temperature: Level-3-260C-168 HR
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage range
AV_DD to AGND⁽²⁾
GPIOV_DD to DGND
SPIV_DD to DGND
AGND to DGND
AIN[0:7], DACOUT[0:3], REF to AGND
CS, SCLK, SDI to DGND
Pin voltage range
SDO to DGND
GPIOA[0:3], GPIOB[0:3], GPIOC[0:3] to DGND
DAV to DGND
Operating free-air temperature range, T_A: AMC7891 ^{(3) (4)}
Storage temperature range
ESD ratings:
Human body model (HBM)
Charged device model (CDM)
VALUE
MIN
MAX
–0.3
6
–0.3
6
–0.3
6
–0.3
0.3
–0.3
–0.3
AV_DD + 0.3
6
–0.3
–0.3
–0.3
SPIV_DD + 0.3
GPIOV_DD + 0.3
6
–40
105
–40
150
2.5
1.0
UNIT
V
V
V
V
V
V
V
V
V
°C
°C
kV
kV
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
(2) AGND1 and AGND2 must be tied together as AGND.
(3) Air flow or heat sinking reduces θ_JA and may be required for sustained operation at 105°C and maximum operating conditions.
(4) Soldering the device thermal pad to the board ground plane is strongly recommended.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
AMC7891
RHH PACKAGE
36 PINS
30.6
16.0
5.3
0.2
5.3
0.8
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): AMC7891
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