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ADC11C125 Datasheet, PDF (5/29 Pages) National Semiconductor (TI) – 11-Bit, 125 MSPS, 1.1 GHz Bandwidth A/D Converter with CMOS Outputs
ADC11C125
www.ti.com
SNAS387C – MAY 2007 – REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)
Supply Voltage (VA, VD)
Supply Voltage (VDR)
|VA–VD|
Voltage on Any Input Pin
(Not to exceed 4.2V)
−0.3V to 4.2V
−0.3V to 2.35V
≤ 100 mV
−0.3V to (VA +0.3V)
Voltage on Any Output Pin
(Not to exceed 2.35V)
Input Current at Any Pin other than Supply Pins(3)
Package Input Current(3)
−0.3V to (VDR +0.2V)
±5 mA
±50 mA
Max Junction Temp (TJ)
Thermal Resistance (θJA)
Package Dissipation at TA = 25°C(4)
ESD Rating
Human Body Model(5)
Machine Model(5)
+150°C
24°C/W
5.2W
2000 V
200 V
Charge Device Model
1000 V
Storage Temperature
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(6)
−65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(3) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be
limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of ±5 mA to 10.
(4) The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient
temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed
above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the
power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
(5) Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω
(6) Reflow temperature profiles are different for lead-free and non-lead-free packages.
Operating Ratings(1)(2)
Operating Temperature
Supply Voltage (VA, VD)
Output Driver Supply (VDR)
CLK
Clock Duty Cycle
Analog Input Pins
VCM
|AGND-DGND|
−40°C ≤ TA ≤ +85°C
+3.0V to +3.6V
+1.6V to +2.0V
−0.05V to (VA + 0.05V)
30/70 %
0V to 2.6V
1.4V to 1.6V
≤100mV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(2) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
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