74ACT11004_16 Datasheet, PDF (5/16 Pages) Texas Instruments – HEX INVERTER

PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2014
PACKAGING INFORMATION
Orderable Device
74ACT11004DBLE
74ACT11004DBR
74ACT11004DW
74ACT11004DWG4
74ACT11004DWR
74ACT11004DWRE4
74ACT11004DWRG4
74ACT11004N
74ACT11004PW
74ACT11004PWG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE SSOP
DB 20
TBD
ACTIVE
SSOP
DB 20 2000 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
DW 20
25 Green (RoHS
& no Sb/Br)
OBSOLETE SOIC
DW 20
TBD
OBSOLETE SOIC
DW 20
TBD
OBSOLETE SOIC
DW 20
TBD
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
ACTIVE TSSOP
PW
20
70 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW
20
70 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Call TI
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Call TI
-40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Call TI
Call TI
Call TI
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
AT004
ACT11004
ACT11004
74ACT11004N
AT004
AT004
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1