SMJ320C31_15 Datasheet, PDF (49/55 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
SMJ320C31GFAM50
Status
(1)
NRND
Package Type Package Pins Package
Drawing
Qty
CPGA
GFA 141
1
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
Call TI
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
SMJ320C31GFAS60
NRND
CPGA
GFA 141
1
TBD
Call TI
N / A for Pkg Type
-55 to 95
SMJ320C31HFGM40
NRND
CFP
HFG 132
1
TBD
Call TI
N / A for Pkg Type -55 to 125
SMJ320C31HFGM50
NRND
CFP
HFG 132
1
TBD
Call TI
N / A for Pkg Type -55 to 125
SMJ320C31HFGS60
NRND
CFP
HFG 132
1
TBD
Call TI
N / A for Pkg Type
-55 to 95
SMQ320LC31PQM40
NRND
BQFP
PQ 132
1
TBD
Call TI
Call TI
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
5962-9205804MX
A
SMJ320C31GFAM5
0
5962-9205805QX
A
SMJ320C31GFAS6
0
5962-9205803MY
A
SMJ320C31HFGM4
0
5962-9205804MY
A
SMJ320C31HFGM5
0
5962-9205805QY
A
SMJ320C31HFGS6
0
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 2